Effects-of pickup variations on chip placement in SMT by finite element modeling-Reference-Cited by-同舟云学术

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Effects-of pickup variations on chip placement in SMT by finite element modeling

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
language:
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Author:

Liu Li¹,Zhang Chunhua¹,Chen Zhiwen¹

Affiliation:

1. Wuhan University of Technology,Wuhan,Hubei,China

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

National Key R&D Program of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013286.pdf?arnumber=10013286

Reference10 articles.

1. Study of The Circumrotation Accuracy Measure of Chip Picking And Placing Machine;hou;Equipment for Electronic Products Manufacturing,2016

2. Development of a Stereo Vision-based Pick and Place System for Robotic Manipulators;thilakanayake;Journal of Instrumentation English version,2021

3. Vacuum-Based Picking-up and Placing-on

4. The Influencing Precision Factor Analysis of Picking and Placing Chip Equipment;hou;Equipment for Electronic Products Manufacturing,2016

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