Soft mask-based dry etching of parylene AF4 for advanced packaging applications
Author:
Affiliation:
1. Silicon Austria Labs,Villach,9524
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013231.pdf?arnumber=10013231
Reference12 articles.
1. Adhesion evaluation of parylene AF4 to silicon and glass substrate
2. Parylene-AF4: a polymer with exceptional dielectric and thermal properties
3. Dry Etching Technology for Semiconductors
4. Silicon Nitride-Based Micro-Apertures Coated with Parylene for the Investigation of Pore Proteins Fused in Free-Standing Lipid Bilayers
5. Non-Thermal Plasma Technology for Polymeric Materials
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1. Fluorinated paracyclophane dimers for polymeric thin films via chemical vapor polymerization;Thin Solid Films;2024-05
2. Influence of Parylene F Coatings on the Wetting Properties of Soft Polydimethylsiloxane (PDMS);Materials;2023-02-26
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