1. Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding;miao;2021 Electronics Packaging Technology Conference (EPTC2021),0
2. Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications;pei;2021 IEEE 71th Electronic Components and Technology Conference,0
3. Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding
4. Novel Cu/SiCN surface topography control for 1 µmpitch hybrid wafer-to-wafer bonding;kim;2020 IEEE 71 th Electronic Components and Technology Conference (ECTC2020),0