Understanding the Impact of Spindle Rotation Direction in the Full Cut Singulation Process of Wettable Flank QFN Packages-Reference-Cited by-同舟云学术

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Understanding the Impact of Spindle Rotation Direction in the Full Cut Singulation Process of Wettable Flank QFN Packages

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Serapio Rohn Kenneth L.¹,Antilano Ernesto T.¹,Soreda Alvin S.¹

Affiliation:

1. STMicroelectronics, Inc.,Calamba City,Laguna,Philippines,4027

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013163.pdf?arnumber=10013163

Reference10 articles.

1. Systematic approach in testing the viability of mechanical partial-cut singulation process towards tin-plateable sidewalls for wettable flank on automotive QFN technology

2. Challenges in Singulation Process of Corner Lead with Wet-Able Pocket on Thin QFN Packages

3. Optimization of Semiconductor Device Packaging Singulation Process

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