Multi-COBS: A Novel Algorithm for Byte Stuffing at High Throughput
Author:
Affiliation:
1. Dipartimento di Elettronica, Informazione e Bioingegneria (DEIB), Politecnico di Milano, Milan, Italy
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/6287639/9668973/09841570.pdf?arnumber=9841570
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