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Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling

  • Published:2021 Issue: Volume:9 Page:76307-76314
  • ISSN:2169-3536
  • Container-title:IEEE Access
  • language:
  • Short-container-title:IEEE Access

Author:

Calabretta MicheleORCID,Sitta AlessandroORCID,Oliveri Salvatore MassimoORCID,Sequenzia GaetanoORCID

Funder

Università degli Studi di Catania

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Online Thermal Parameter Identification Method for MOSFETs in DC-DC converters;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

2. Effects of the pin-fins cooler roughness on the thermo-fluid dynamics performance of a SiC power module;International Journal of Thermofluids;2024-05

3. Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module Under Several Operating Condition;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

4. Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop;Lecture Notes in Mechanical Engineering;2024

5. Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules;IEEE Transactions on Intelligent Vehicles;2023-12
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