Explainable Deep Learning System for Advanced Silicon and Silicon Carbide Electrical Wafer Defect Map Assessment-Reference-Cited by-同舟云学术

Explainable Deep Learning System for Advanced Silicon and Silicon Carbide Electrical Wafer Defect Map Assessment

Published:2022 Issue: Volume:10 Page:99102-99128
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Sarpietro Riccardo Emanuele¹,Pino Carmelo¹,Coffa Salvatore¹,Messina Angelo¹^ORCID,Palazzo Simone²,Battiato Sebastiano³,Spampinato Concetto²,Rundo Francesco¹^ORCID

Affiliation:

1. STMicroelectronics, ADG Research and Development Power and Discretes, Catania, Italy

2. Department of Electrical, Electronics and Computer Engineering, Pattern Recognition and Computer Vision Laboratory (PeRCeiVe Lab), University of Catania, Catania, Italy

3. Dipartimento di Matematica e Informatica (DMI), Image Processing Laboratory (IP-LAB) Group, University of Catania, Catania, Italy

Funder

Horizon 2020 Framework Programme

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/6287639/9668973/09877886.pdf?arnumber=9877886

Reference58 articles.

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3. UMAP: Uniform manifold approximation and projection for dimension reduction;mcinnes;arXiv 1802 03426,2018

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