Impact and Vulnerability Analysis of IEC61850 in Smartgrids Using Multiple HIL Real-Time Testbeds
Author:
Affiliation:
1. Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano, Milan, Italy
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/6287639/9668973/09903440.pdf?arnumber=9903440
Reference28 articles.
1. Real-time Smart Microgrid Simulation: The integration of communication layer in electrical simulation
2. Hardware-in-the-Loop Experimental Validation for a Lab-Scale Microgrid Targeted by Cyberattacks
3. Hardware In The Loop Simulation of the Smart Grid with the inclusion of IEC61850 Communication Protocol
4. A Method for Achieving Confidentiality and Integrity in IEC 61850 GOOSE Messages
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