HBLP: A Hybrid Underlay-Interweave Mode CRN for the Future 5G-Based Internet of Things
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science
Link
http://xplorestaging.ieee.org/ielx7/6287639/8948470/09039624.pdf?arnumber=9039624
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