Traceback Analysis of Unknown Nanoparticles Formation Mechanism on OSP Surface Finished PCB for Flip-Chip Package
Author:
Affiliation:
1. Department of Chemical and Biological Engineering, Hanbat National University, Daejeon, South Korea
2. Department of Intelligent Nano Semiconductor, Hanbat National University, Daejeon, South Korea
Funder
Agency for Defense Development
Korea Evaluation Institute of Industrial Technology
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx8/6287639/10380310/10597617.pdf?arnumber=10597617
Reference43 articles.
1. Establishment of Highly Dense Wire Bonding with Insulated Au Wire
2. Toward Synthetic Vascular Graft Monitoring Using a Flip-Chip-on-Flex Impedance Spectroscopy Sensor
3. Development of a numerical simulation model for predicting the temperature of a flip-chip package during the laser-assisted bonding (LAB) process
4. Generational changes of flip chip interconnection technology
5. A review on numerical approach of reflow soldering process for copper pillar technology
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