Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration-Reference-Cited by-同舟云学术

Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration

Published:2024 Issue: Volume:12 Page:48081-48107
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Sami Md Sami Ul Islam¹^ORCID,Zhang Tao¹^ORCID,Shuvo Amit Mazumder¹^ORCID,Haque Md Saad Ul¹,Calzada Paul E.¹^ORCID,Azar Kimia Zamiri¹,Kamali Hadi Mardani¹^ORCID,Rahman Fahim¹,Farahmandi Farimah¹,Tehranipoor Mark¹

Affiliation:

1. Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/6287639/10380310/10466542.pdf?arnumber=10466542

Reference137 articles.

1. Chiplet Heterogeneous Integration Technology—Status and Challenges

2. Enabling Security of Heterogeneous Integration: From Supply Chain to In-Field Operations

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced lightweight encryption algorithm based on chaotic systems;Physica Scripta;2024-09-12

2. Semiconductor supply chain resilience and disruption: insights, mitigation, and future directions;International Journal of Production Research;2024-08-13

3. SAP: Silicon Authentication Platform for System-on-Chip Supply Chain Vulnerabilities;2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS);2024-05-05

4. Hardware Trojans Detection and Prevention Techniques Review;Wireless Personal Communications;2024-05