A Broadband Inline Transition From On-PCB Microstrip to Hybrid Stack-Up Integrated Additively Fabricated Air-Filled Waveguide
Author:
Affiliation:
1. Institite of Electronics, AGH University of Krakow, Kraków, Poland
2. Department of Electrical, Computer and Biomedical Engineering, University of Pavia, Pavia, Italy
Funder
National Science Centre, Poland
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/6287639/10380310/10388325.pdf?arnumber=10388325
Reference37 articles.
1. Additive manufacturing: a key enabling technology for next-generation microwave and millimeter-wave systems [point of view]
2. Additively Manufactured RF Components and Modules: Toward Empowering the Birth of Cost-Efficient Dense and Ubiquitous IoT Implementations
3. Exploring 3-D Printing for New Applications: Novel Inkjet- and 3-D-Printed Millimeter-Wave Components, Interconnects, and Systems
4. Metal-Coated 3D-Printed Waveguide Devices for mm-Wave Applications [Application Notes]
5. 3D Printed high functional density packaging compatible out-of-plane antennas
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1. Design and Simulation of Wearable Antennas for Healthcare;Advances in Medical Technologies and Clinical Practice;2024-09-13
2. Study on Low Resistance Permanent Joints for Assembly of PCB-Integrated Additively Fabricated Air-Filled Waveguide;2024 25th International Microwave and Radar Conference (MIKON);2024-07-01
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