Affiliation:
1. Yangzhou Academy of Collaboration and Innovation Company Ltd., Yangzhou, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering
Reference34 articles.
1. Multifunctional integrated substrate technology for high density SOP packaging;liu;Proc 6th IEEE CPMT Conf High Density Microsyst Design Packag Compon Failure Anal (HDP),2004
Cited by
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