New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications
Author:
Affiliation:
1. LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France
2. Mitsubishi Electric R&D Centre Europe, Rennes, France
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science,Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/6287639/10005208/10330586.pdf?arnumber=10330586
Reference31 articles.
1. Printed circuit board embedded power semiconductors: A technology review
2. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging
3. PCB Embedded Semiconductors for Low-Voltage Power Electronic Applications
4. Dielectric strength and thermal performance of PCB-embedded power electronics
5. New Failure Mechanism in High Temperature Resin Materials
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