Impact of the Bonding Design Parameters on the Shielding Effectiveness of Board-Level Shields at Microwave frequencies-Reference-Cited by-同舟云学术

Impact of the Bonding Design Parameters on the Shielding Effectiveness of Board-Level Shields at Microwave frequencies

Published:2022-09-05 Issue: Volume: Page:
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Container-title:2022 International Symposium on Electromagnetic Compatibility – EMC Europe
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Author:

Radhakrishnan Pavithrakrishnan¹,Claeys Tim¹,Catrysse Johan¹,Pissoort Davy¹

Affiliation:

1. ESAT-WaveCore, M-Group KU Leuven, Bruges Campus,Brugge,Belgium,B-8200

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9900492/9900921/09901088.pdf?arnumber=9901088

Reference11 articles.

1. Near-Field Scanning-Based Shielding Effectiveness Extraction for Board-Level Shielding Cans

2. Experimental Verification of Board Level Shielding Variability at Microwave Frequencies

3. IEEE Guide for the Electromagnetic Characterization of Conductive Gaskets in the Frequency Range of DC to 40 GHz;IEEE Std 1302–2019 (Revision of IEEE Std 1302–2008) pp,2020

4. IC-stripline: a new proposal for susceptibility and emission testing of IC's;koerber;Proceedings EMC Compo 2007,0

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of Low Frequency Electric and Magnetic Shielding Effectiveness of Board-Level Shields using the Stripline Method;2023 International Symposium on Electromagnetic Compatibility – EMC Europe;2023-09-04

2. Shielding Effectiveness Evaluation of Enclosure on PCB by Nesting Cavities Test Method;IEEE Transactions on Instrumentation and Measurement;2023

3. An Overview of the New IEEE P2716 Guide to Board Level Shielding;IEEE Electromagnetic Compatibility Magazine;2023