Application of Silicon Piezoresistive Effect in Mems Embedded Microlfuidic Cooling-Reference-Cited by-同舟云学术

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Application of Silicon Piezoresistive Effect in Mems Embedded Microlfuidic Cooling

Published:2022-01-09 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)
language:
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Author:

Ye Yuxin¹,Yun Shichang¹,Liu Ruiwen¹,Li Wei²,Wang Zhiqiang²,Du Xiangbin¹,Kong Yanmei¹,Jia Kunpeng¹,Zhang Nan¹,Yu Lihang¹,Cong Bo¹,Jia Shiqi¹,Jiao Binbin¹,Chen Dapeng¹

Affiliation:

1. Institute of Microelectronics of the Chinese Academy of Science,CHINA

2. CETC Information Science Academy,CHINA

Funder

Key Technologies Research and Development Program

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9698823/9699435/09699818.pdf?arnumber=9699818

Reference9 articles.

1. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review

2. Efficient Microchannel Cooling of Multiple Power Devices With Compact Flow Distribution for High Power-Density Converters

3. The Piezoresistive Effect and its Applications

4. Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation

5. Microchannel Cooling Strategies for High Heat Flux (1kW/cm2) Power Electronic Applications;wrok jung;16th IEEE ITHERM Conference,0

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