1. Jiangsu Key Laboratory of 3D Printing Equipment and Manufacturing, School of Electrical and Automation Engineering, Nanjing Normal University, Nanjing, China
2. School of Information and Communications Engineering, Xi’an Jiaotong University, Xi’an, China
3. Hengdian Electronics Company Ltd., Nanjing, China
4. Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macau, SAR, China
5. Department of Electrical, Electronic and Computer Engineering, School of Engineering and Physical Sciences, Heriot-Watt University, Edinburgh, U.K.