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Transient Electromagnetic–Thermal Cosimulation for Micrometer-Level Components

  • Published:2021-10 Issue:10 Volume:69 Page:4341-4351
  • ISSN:0018-9480
  • Container-title:IEEE Transactions on Microwave Theory and Techniques
  • language:
  • Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Xue Yilun,Ren QiangORCID,Chen JiefuORCID,Zhou YuanguoORCID

Funder

National Natural Science Foundation of China

Defense Industrial Technology Development Program

Stable Operation Project

National Science and Technology Major Project

Natural Science Basic Research Plan in Shaanxi Province of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Transient Electromagnetic–Thermal Co-Simulation of Microwave/RF Integrated Circuits by the HIE-FDTD Method;IEEE Transactions on Microwave Theory and Techniques;2024-09

2. Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

3. Electromagnetic-Circuital-Thermal-Mechanical Multiphysics Numerical Simulation Method for Microwave Circuits;IEEE Journal on Multiscale and Multiphysics Computational Techniques;2024

4. A Stochastic FDTD Algorithm for Uncertainty Quantification of Electromagnetic-Thermal Simulation;IEEE Transactions on Microwave Theory and Techniques;2024

5. Practice and Analysis of Electromagnetic Interference Influence of Relay Protection Devices Under Thermal Stress;2023 IEEE 7th Conference on Energy Internet and Energy System Integration (EI2);2023-12-15
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