Monolithically Integrated Directly Pumped Time-Varying Transmission Lines
Author:
Affiliation:
1. Qualcomm, Santa Clara, CA, USA
2. Google, LLC, Mountain View, CA, USA
3. Electrical and Computer Engineering Department, University of California at Los Angeles, Los Angeles, CA, USA
Funder
DARPA Microsystem Technology Office through Boeing
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx7/22/10091956/09965580.pdf?arnumber=9965580
Reference13 articles.
1. Analytic Design of on-Chip Spiral Inductor with Variable Line Width
2. High-Q 3D RF solenoid inductors in glass
3. Jamming Resilient Spread Spectrum Receiver with Time-Varying Transmission Line (TVTL) RF Correlator
4. Parametric Amplification and Frequency Mixing in Propagating Circuits
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