Planarized and Nanopatterned Mesoporous Silica Thin Films by Chemical-Mechanical Polishing of Gap-Filled Topographically Patterned Substrates-Reference-Cited by-同舟云学术

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Planarized and Nanopatterned Mesoporous Silica Thin Films by Chemical-Mechanical Polishing of Gap-Filled Topographically Patterned Substrates

Published:2011-05 Issue:3 Volume:10 Page:451-461
ISSN:1536-125X
Container-title:IEEE Transactions on Nanotechnology
language:
Short-container-title:IEEE Trans. Nanotechnology

Author:

Arnold D C,Blake A,Quinn J,Iacopino D,Tobin J M,O'Mahony Colm,Holmes J D,Morris M A

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications

Link

http://xplorestaging.ieee.org/ielx5/7729/5764947/05439865.pdf?arnumber=5439865

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Disiloxane-Bridged Cyclopolymer as Polymer Dielectrics;Chinese Journal of Chemical Physics;2017-10-27

2. Narrow gap filling in 25nm shallow trench isolation using highly porous organosilica;Thin Solid Films;2014-07

3. Mechanical Property Investigation of Soft Materials by Cantilever-Based Optical Interfacial Force Microscopy;Scanning;2012-07-05

4. Advances in Ultra Low Dielectric Constant Ordered Porous Materials;Interface magazine;2011-01-01

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