Author:
Yaejima Ryosuke,Okuno Shota,Yu Qiang,Nakata Yusuke,Sugawara Hiroyuki
Cited by
2 articles.
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1. Porosity effect on fatigue life of sintered silver during thermal cycling;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
2. Overview of Finite-Element Analysis in Simulation of SiC Power Device Packaging;2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS);2021-12-06