Dynamic simulation of die pickup from wafer tape by a multi-disc ejector using peel-energy to peel-velocity coupling
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ultra thin die pickup: peel stage and pickup tool design comparison;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Transient Thermal Modeling of Die Bond Process in Multiple Die Stacked Flash Memory Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05