Author:
Wai Leong Ching,Mariyappan Dhayalan,Koh Chee Guan,Chai Tai Chong
Cited by
2 articles.
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1. Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Novel methodology for 3D FEM modeling of wire bonding process by ball deformation reproduction;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25