Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip-Reference-Cited by-同舟云学术

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Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/Low-K Chip

Published:2014-12 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)
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Author:

Au K. Y.,Che F. X,Aw Jie Li,Lin Jong-Kai,Boehme Bjoern,Kuechenmeister Frank

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7005556/7028249/07028369.pdf?arnumber=7028369

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study of flip ultrasonic bonding process with Non-conductive paste;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Assembly Process and Application Studies of Pre-Applied Underfill Non-Conductive Film (NCF) and Non-Conductive Paste (NCP) for Advanced Packages;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

3. Intermetallic Compounds at the Interfaces of Ag–Pd Alloy Stud Bumps With Al Pads;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-10

4. Development and optimization of the laser-assisted bonding process for a flip chip package;Microsystem Technologies;2019-09-16

5. Improvement of Fundamental Technology of 3-D Thermal Compression Bonding With High Accuracy;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-05

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