Author:
Runde M.,Hodne E.,Totdal B.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Thermally Induced Mechanical Degradation of Contact Spots in Aluminum Interfaces;IEEE Transactions on Components and Packaging Technologies;2006-12
2. Thermally induced mechanical degradation of contact spots in aluminum interfaces;Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts Electrical Contacts, 2004.