MIM Capacitor Integration for Mixed-Signal/RF Applications-Reference-Cited by-同舟云学术

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MIM Capacitor Integration for Mixed-Signal/RF Applications

Published:2005-07 Issue:7 Volume:52 Page:1399-1409
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:en
Short-container-title:IEEE Trans. Electron Devices

Author:

Ng C.H.,Ho C.-S.,Chu S.-F.S.,Sun S.-C.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/16/31407/01459098.pdf?arnumber=1459098

Cited by 70 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Voltage ramp stress based lifetime-prediction model of advanced Al-doped HfO2 dielectric for 2.5D MIMCAPs;Solid-State Electronics;2024-03

2. On-silicon Capacitor Sharing Technique Based on Package Power Merging for PDN Optimization;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

3. Enhancing capacitance of dielectric Si-oxide film by inserting indium-tin-oxide interlayer;Journal of Physics D: Applied Physics;2023-05-15

4. Development of High-Density Metal-Insulator-Metal Capacitors with Top and Side Contacts;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

5. Elimination of Cu Precipitation in Al-Cu films due to the Effect of Thermal Cycles;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01

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