Physics-based modeling of FinFET RF variability
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7764428/7777458/07777534.pdf?arnumber=7777534
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Synergic Exploitation of TCAD and Deep Neural Networks for Nonlinear FinFET Modeling;IEEE EUROCON 2023 - 20th International Conference on Smart Technologies;2023-07-06
2. Spatial distribution of microwave device harmonic electrical variables through T-dependent TCAD simulations;IEEE EUROCON 2023 - 20th International Conference on Smart Technologies;2023-07-06
3. Multi-bias Thermal X-Parameter Model for Efficient Physics-Based FinFET Simulation in RF CAD Tools;Proceedings of SIE 2022;2023
4. Thermal modeling of RF FinFET PAs through temperature-dependent X-parameters extracted from physics-based simulations;2022 International Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits (INMMiC);2022-04-07
5. Bridging the Gap between Physical and Circuit Analysis for Variability-Aware Microwave Design: Modeling Approaches;Electronics;2022-03-09
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