On the analysis of dynamic effect in the die pick-up process-Reference-Cited by-同舟云学术

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On the analysis of dynamic effect in the die pick-up process

Published:2011-08 Issue: Volume: Page:
ISSN:
Container-title:2011 12th International Conference on Electronic Packaging Technology and High Density Packaging
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Author:

Peng Bo,Huang YongAn,Yin ZhouPing,Xiong YouLun

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6056740/6066691/06066916.pdf?arnumber=6066916

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of collet on the die stress during die pick-up;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

2. Development of a Flexure Mechanism for Thin Die Pick-up Process;2022 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO);2022-08-08

3. Vacuum-Based Picking-up and Placing-on;Modeling and Application of Flexible Electronics Packaging;2019

4. Single-needle Peeling;Modeling and Application of Flexible Electronics Packaging;2019

5. Advanced Electronic Packaging;Modeling and Application of Flexible Electronics Packaging;2019

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