Author:
Van Hal B.A.E.,Zhang G.Q.,Van Gils M.A.J.,Peerlings R.H.J
Cited by
2 articles.
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1. Acoustic softening characterization to improve copper wire bonding FEM simulation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05