Thermal imaging based on Thermoreflectance addresses the challenges for thermal analysis of today's advanced complex devices-Reference-Cited by-同舟云学术

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Thermal imaging based on Thermoreflectance addresses the challenges for thermal analysis of today's advanced complex devices

Published:2016-08 Issue: Volume: Page:
ISSN:
Container-title:2016 17th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Kendig Dustin,Tay Andrew A. O.,Shakouri Ali

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7574980/7583073/07583411.pdf?arnumber=7583411

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temperature-Dependent Hydrogen Modulations of Ultra-Scaled a-IGZO Thin Film Transistor Under Gate Bias Stress;IEEE Open Journal of Nanotechnology;2024

2. Mechanism of Threshold Voltage Instability in Double Gate α-IGZO Nanosheet TFT Under Bias and Temperature Stress;IEEE Journal of the Electron Devices Society;2024

3. Failure Analysis by Infrared and Thermoreflectance Imaging Applied on Active Devices;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28

4. Thermometry in Laser Micro/Nanofabrication;Handbook of Laser Micro- and Nano-Engineering;2021

5. Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics;Journal of Electronic Packaging;2020-05-21

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