Author:
Pan Yongjun,Zhu Fulong,Lin Xinxin,Tao Jiaquan,He Liping,Wang Han,Liu Sheng
Cited by
4 articles.
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1. Modeling and Optimization of Mechanical Performance for Cu Wire Bonding Process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Novel methodology for 3D FEM modeling of wire bonding process by ball deformation reproduction;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
3. Analysis and Optimization of Fine-Pitch Gold Wire Ball Bonding Thermosonic Parameters;2021 35th Symposium on Microelectronics Technology and Devices (SBMicro);2021-08-23
4. Investigation Regarding the Influence of Contact Condition on the Thermal Contact Resistance Between Copper and Indium;IEEE Transactions on Electron Devices;2021-08