Author:
Hu Ian,Lai Wei-Hong,Wang Ming-Han
Cited by
2 articles.
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1. The Effect of Epoxy Molding Compound Dispensing Uniformity on PoP Warpage;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Hybrid Fan-out Package for Vertical Heterogeneous Integration;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06