Author:
Sigl A.,Pargfrieder S.,Pichler C.,Scheiring C.,Kettner P.
Cited by
2 articles.
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1. Architecting Waferscale Processors - A GPU Case Study;2019 IEEE International Symposium on High Performance Computer Architecture (HPCA);2019-02
2. Effect of bonding time on the microstructure and mechanical properties of Co/Sn/Cu joint;Journal of Materials Science: Materials in Electronics;2017-10-10