Author:
Yao Xin,Xiao Zhiqiang,Ming Xuefei,Cao Yuyuan,Ji Yong
Cited by
2 articles.
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1. Warpage Analysis and Optimization of Fan-Out Panel-Level Packaging with Chip-Last Process;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
2. LQFP Warpage Optimization Based on Variance Analysis Method;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08