Author:
Liu Linqi,Jiang Wei,Liu Qiang,Lin Wei,Miao Xiaoyong,Shi Lei
Cited by
3 articles.
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1. Design Optimization for Dual Clip Flat Lead Package Assembly by Simulation;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Application of Simulation to Enhance Complex Clipbond Package Mold Tools;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19
3. Development of solderable layer on power MOSFET for double-side bonding;Microelectronics Reliability;2022-02