Author:
Wang Jin,Hou Xinnan,Li Jianming,Wang Qian,Du Ke,Cai Jian
Cited by
2 articles.
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1. Simulation-based Optimization Design of an Iris Recognition Module Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
2. Au-Rich/Sn-Bi Interconnection in Chip-on-Module Package;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05