Author:
Xie Huiqin,Li Jun,Song Jian,Hou Fengze,Guo Xueping,Wang Shuling,Daquan Yu,Liqiang Cao,Wan Lixi
Cited by
7 articles.
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3. A novel 3D plastic packaging technology with high overload ability and its application in microsystem;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
4. Modeling group behavior based on stochastic cellular automata with memory and systems of differential kinetic equations with delay;Vestnik Tomskogo gosudarstvennogo universiteta. Upravlenie, vychislitel'naya tekhnika i informatika;2020-06-01
5. Study on Advanced Substrate for Double-side Package to Reduce Module Size;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06