Investigation on PCB related failures in high-density electronic assemblies-Reference-Cited by-同舟云学术

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Investigation on PCB related failures in high-density electronic assemblies

Published:2009-08 Issue: Volume: Page:
ISSN:
Container-title:2009 International Conference on Electronic Packaging Technology & High Density Packaging
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Author:

Lu L. N.,Huang H. Z.,Su X. X.,Wu B. Y.,Cai M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5234372/5270539/05270780.pdf?arnumber=5270780

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A novel soldering method to evaluate PCB pad cratering for pin-pull testing;Microelectronics Reliability;2013-09

2. Investigation on PCB pad strength;2010 11th International Conference on Electronic Packaging Technology & High Density Packaging;2010-08

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