PCB Layout for Chip-Scale Package GaN Fets Optimizes Both Electrical and Thermal Performance-Reference-Cited by-同舟云学术

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PCB Layout for Chip-Scale Package GaN Fets Optimizes Both Electrical and Thermal Performance

Published:2022-03-20 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Applied Power Electronics Conference and Exposition (APEC)
language:
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Author:

Glaser John S.¹,Helou Assaad¹

Affiliation:

1. Efficient Power Conversion Corporation,El Segundo,CA,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9773364/9773365/09773765.pdf?arnumber=9773765

Reference12 articles.

1. Characterization of Wide Bandgap Power Semiconductor Devices

2. How2AppNote012 - How to Get More Power Out of an eGaN Converter.pdf;helou;Application Note Efficient Power Conversion Corporation,2021

3. AN-2020 Thermal Design By Insight, Not Hindsight;Application note AN-2020,2013

4. Thermal Performance of EPC eGaN® FETs;worman;Application Note Efficient Power Conversion Corporation,2019

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. GaN Technology;GaN Technology;2024

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