Design Trade-offs and Considerations for Improving the PCB Current Carrying Capacity in High Power Density Power Electronics Applications
Author:
Affiliation:
1. Elektra Elektronik Sanayi ve Ticaret A.S.,Research and Development Department,Istanbul,Turkey
2. Isik University,Department of Electrical Engineering,Sile,Istanbul,Turkey
Funder
Elektra Elektronik San. Tic. A.S. and The Scientific and Technological Research Council of Turkey project
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9773364/9773365/09773486.pdf?arnumber=9773486
Reference18 articles.
1. Optimization of thermal via design parameters based on an analytical thermal resistance model
2. Optimization of thermal vias for thermal resistance in FR-4 PCBs
3. Simulation on heat transfer of microchannels and thermal vias for high power electronic packages
4. Thermal via placement for high-power applications
5. IPC ORDER PO-2152;Information and Privacy Commissioner Toronto Ontaria,2003
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