Thermal investigation of an infrared reflow furnace with a convection fan-Reference-Cited by-同舟云学术

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Thermal investigation of an infrared reflow furnace with a convection fan

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Container-title:InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V
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Author:

Kim M.R.,Choi Y.K.,Lee G.B.,Chung I.Y.,Kim J.D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/3801/11129/00534564.pdf?arnumber=534564

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. CFD Investigation of the Soldering Process for a Small Spherical PCM Made of Lead-tin Alloy;International Journal of Mechanics;2023-03-03

2. Low-Cost Non-Contact PCBs Temperature Monitoring and Control in a Hot Air Reflow Process Based on Multiple Thermocouples Data Fusion;IEEE Access;2021

3. Parametric numerical study for energy savings in industrial drying process;International Journal of Precision Engineering and Manufacturing;2014-03

4. A numerical approach to energy savings in heat drying process of drilled and water-cleaned PCB;International Journal of Precision Engineering and Manufacturing;2013-06

5. Analysis of energy efficiency in PCB manufacturing process;International Journal of Precision Engineering and Manufacturing;2012-07

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