A Benchmark Study on the Thermal Performance and Life of Different Structures of SiC Chip Modules-Reference-Cited by-同舟云学术

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A Benchmark Study on the Thermal Performance and Life of Different Structures of SiC Chip Modules

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Hiraoka Gakuto¹,Yoshikawa Ryotaro¹,Ito Yuta¹,Yu Qiang¹,Komatsu Yuji²,Chiron Thomas²,Schon Wolfgang³

Affiliation:

1. Yokohama National University,Kanagawa,Japan,240-0067

2. ZF Japan Co., Ltd.,Yokohama,Japan,231-0801

3. ZF Friedrichshafen AG,Friedrichshafen,Germany,88046

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899685.pdf?arnumber=9899685

Reference10 articles.

1. SiC—Emerging Power Device Technology for Next-Generation Electrically Powered Environmentally Friendly Vehicles

2. Silicon limit electrical characteristics of power devices and Ics

3. DBC-Packaged Inverter Power Module for Integrated Motor-Inverter Design Used in 48 V Mild Hybrid Starter-Generator (MHSG) System

4. Reliability Evaluation of Electrical-Thermal-Structural Coupled Analysis Based on Driving Date;nakayama,2016

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