Effect of Long-Term Isothermal Exposure on Chip/Underfill Interfacial Crack Growth Under Mode – I Fatigue Loading-Reference-Cited by-同舟云学术

Effect of Long-Term Isothermal Exposure on Chip/Underfill Interfacial Crack Growth Under Mode – I Fatigue Loading

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Lall Pradeep¹,Ram Pandurangan Aathi Raja¹

Affiliation:

1. Auburn University,NSF-CAVE3, Electronic Research Center,Department of Mechanical Engineering,Auburn,AL,36849

Funder

Semiconductor Research Corporation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899578.pdf?arnumber=9899578

Reference16 articles.

1. Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability

2. Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading;lall;Proceedings of the ASME 2019 International Technical Conferenceand Exhibition on Packaging and Integration of Electronic and Photonic Microsystems ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems,2019

3. Interfacial Fracture Toughness of PCB/Epoxy Interfaces Under Three Point and Four Point Loading with Sustained High Temperature Exposure

4. Effect of Shock Angle on Solder-Joint Reliability of Potted Assemblies Under High-G Shock

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