Boiling and Condensation of a Dielectric Liquid in a Closed Enclosure for Electronics Cooling Applications
Author:
Affiliation:
1. Université de Sherbrooke,Institut Interdisciplinaire d’Innovation Technologique (3IT),Department of Mechanical Engineering,Sherbrooke,Canada
Funder
Natural Sciences and Engineering Research Council of Canada
Research and Development
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899604.pdf?arnumber=9899604
Reference19 articles.
1. On-chip two-phase cooling of datacenters: Cooling system and energy recovery evaluation
2. Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
3. Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part I: Design and Performance Simulation
4. Experimental Investigation of a Direct Liquid Immersion Cooled Prototype for High Performance Electronic Systems
5. Observation of critical heat flux mechanism in horizontal pool boiling of saturated water
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Pushing the Limits of Air Cooling with Novel Two-Phase Prototypes for High Power Microprocessors;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3