Circuit-level Thermal Modelling of Silicon Photonic Transceiver Array using Machine Learning-Reference-Cited by-同舟云学术

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Circuit-level Thermal Modelling of Silicon Photonic Transceiver Array using Machine Learning

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Coenen David¹,Oprins Herman²,Wolf Ingrid De¹

Affiliation:

1. KU Leuven,Dept. Materials Eng.,Belgium

2. Imec,Leuven,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899585.pdf?arnumber=9899585

Reference22 articles.

1. An artificial neural network framework for reduced order modeling of transient flows

2. The Two Point Correlation Structure of a Cylinder Wake;molinaro;Master's thesis Virginia Polytechnic Institute and State University,2017

3. Thermal Aspects of Silicon Photonic Interposer Packages

4. Fast circuit modeling of heat transfer in photonic integrated circuits

5. A Methodology for Thermal Characterization Abstraction of Integrated Opto-Electronic Layouts

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Physics-informed reduced-order learning from the first principles for simulation of quantum nanostructures;Scientific Reports;2023-04-16

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