Heat Dissipation Characteristics of a Jetting Staggered Microchannel for Cooling a Large-area High-performance SOC Chip-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Heat Dissipation Characteristics of a Jetting Staggered Microchannel for Cooling a Large-area High-performance SOC Chip

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
language:
Short-container-title:

Author:

Lian Tingting¹,Wang Zhizheng¹,Yuan Hai²,Jin Yufeng³,Wang Wei⁴,Ma Shenglin¹

Affiliation:

1. Xiamen University,Department of Mechanical and Electrical Engineering,Xiamen,China

2. Xi'an Microelectronics Technology Institute,Xi'an,China

3. Shenzhen Graduate School of Peking University,Shenzhen,China

4. Peking University,Institute of Microelectronics,Beijing,China

Funder

National Natural Science Foundation of China

Aeronautical Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899524.pdf?arnumber=9899524

Reference10 articles.

1. Investigation of Liquid Cooling for Data Center Server Based on Micro-fluid Technology

2. 3-D Stacked Tier-Specific Microfluidic Cooling for Heterogeneous 3-D ICs

3. Co-designing electronics with microfluidics for more sustainable cooling

4. Experimental and Numerical Study of 3D Printed Direct Jet Impingement Cooling for High Power, Large Die Size Applications[J];wei;IEEE Transactions on Components Packaging and Manufacturing Technology Part A,2020

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP