Experimental Characterization of a Compact Thermosyphon Cooling System Operating with R1234ze(E) and R1233zd(E) Low-GWP Refrigerants-Reference-Cited by-同舟云学术

Experimental Characterization of a Compact Thermosyphon Cooling System Operating with R1234ze(E) and R1233zd(E) Low-GWP Refrigerants

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Amalfi Raffaele L.¹,Hoang Cong H.¹,Enright Ryan¹,Kim John²,Cataldo Filippo³,Marcinichen Jackson B.⁴,Thome John R.⁵

Affiliation:

1. Nokia Bell Labs,Thermal Management Group,Murray Hill,NJ,USA,07974

2. Nokia Bell Labs,Data and Devices Group,Murray Hill,NJ,USA,07974

3. Provides Metalmeccanica S.r.l,Micro-Technologies Department,Latina,Italy,04100

4. JJ Cooling Innovation Sàrl,Lausanne,Switzerland,1015

5. JJ Cooling Sàrl,Lausanne,Switzerland,1015

Funder

Horizon 2020 Framework Programme

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899592.pdf?arnumber=9899592

Reference16 articles.

1. Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part II: Experimental Results and Validation

2. Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosyphon Heat Sink;kulkarni;Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) United States 2019,0

3. Thermosyphon simulation code: transient thermal performance and experimental validation

4. Experimental Characterization of a Server-Level Thermosyphon for High-Heat Flux Dissipations;amalfi;13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm,2020

5. Implementation of Passive Two-Phase Cooling to an Entire Server Rack;cataldo;13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm,2020