An Advanced Fan-less AIoT Smart Edge Gateway with Thickness Thermal Pad Design
Author:
Yuan Huayong1,
Chen Wei1,
King Michael2,
Wu Aaron2,
Chen Barry2,
Chiu Clio2,
Tseng Karen2,
Su Lulu2,
Chang Richard2,
Yang Ryan2,
Leu Shoes2,
Liang Allen3,
Zhang Jun3,
Chen Haibin3,
Liu Liang3,
Kuo Danny3,
Zhu Kunye3,
Ahuja Nishi3,
Qiao Qing3,
Li Eric3
Affiliation:
1. Tencent
2. Inventec Corporation
3. Intel Corporation