Hybrid Vapor Chamber-based Cooling System for Power Electronics
Author:
Affiliation:
1. University of Illinois at Chicago,Mechanical and Industrial Engineering,Chicago,IL,USA
2. University of Illinois at Chicago,Electrical and Computer Engineering,Chicago,IL,USA
Funder
Office of Naval Research
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899601.pdf?arnumber=9899601
Reference15 articles.
1. High-performance Planar Thermal Diode with Wickless Components;damoulakis;Journal of Electronic Packaging,2021
2. Experimental investigation of low-profile heat pipe with wickless wettability-patterned condenser
3. Wick-Free Paradigm for High-Performance Vapor-Chamber Heat Spreaders;damoulakis;Energy Conversation and Management,2021
4. Vapor Chamber Thermal Diode with Laser- fabricated Wickless Components
5. Single-Crystalline Scroll-Type Nanotube Arrays of Copper Hydroxide Synthesized at Room Temperature
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. Thermal Performance of a Liquid-cooling Assisted Thin Wickless Vapor Chamber;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
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