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Reliability and Lifetime Prediction Model of Sintered Silver under High-Temperature Cycling

  • Published:2021 Issue: Volume: Page:1-1
  • ISSN:2168-6777
  • Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
  • language:
  • Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Paret Paul,Major Joshua,De Voto Douglas,Narumanchi Sreekant,Ding Chao,Lu Guo-Quan

Funder

Vehicle Technologies Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Toward Direct Cooling in High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

3. Thermo-Mechanical Analysis of a 650 V/150 A e-GaN HEMT Sandwiched Between a PCB and DBC Substrate;2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA);2023-12-04

4. Effects of Encapsulant Properties on the Thermo-Mechanical Reliability of Double-Side Cooled Power Modules for Traction Inverters;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

5. Reliability Improvement of Low-Temperature Sintered Nano-Silver as Die Attachment by Porosity Optimization;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08
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